Thickness ultrabook new generation will be reduced to 15 mm

As part of the annual conference for developers IDF Intel representative told us what they see ultrabooks next generation.

Thickness on the market ultrabooks usually is 17-20 mm. In Intel expects that the next generation will be able to reduce the thickness of a few millimeters. Thus, as part of the event was showcased ultrabook NEC LaVie Z thickness of 15 mm, which is available from the end of August on the market in Japan.

The model is equipped with 13.3-inch display with a resolution of 1600 x 900 pixels, an Intel Core of the third generation (Ivy Bridge) with integrated graphics, 4GB of memory, flash storage capacity of 128 GB, support for USB 3.0 and HDMI.

Create thinner laptops will allow the development of the industry of electronic components, explained in Intel. Thus, the thickest part of the hard drive will be - 5 mm. This newly introduced Western Digital. The thickness of the battery will be from 3 to 5 mm and keyboard - not more than 2.5 mm, and the LCD screen - 2.4 mm.

In addition, with the release of the fourth-generation Core processors (codenamed Haswell) in the future, Intel expects to significantly increase the battery life of ultrabooks. The TDP of these processors will be between 10 watts.